02
11
2018

Process capability parameters

Process capability parameters Process capability convention

Contact

Contact: Mr. Li

Contact Hotline:29983870

Mobile phone:13510458008

E-mail:bydpcb@126.com

Problem

Ask
Answer
Paper based circuit boards are divided into flame retardant and non flame retardant according to their flame retardant p……
Ask
Answer
The analysis of the reasons for electroplating nickel gold plates on multi-layer circuit boards can be studied from the ……
Ask
Answer
1. How to choose PCB board?The selection of PCB boards must ……
Ask
Answer
Q: What is the probability of repairing the circuit board? Answer: Our repair rate remains above 90%. However, circuit b……
Ask
Answer
With the transformation of surface soldering to lead-free type, the soldering temperature that circuit boards need to wi……
Ask
Answer
The growing demand from users for increasingly complex large-sized backplanes that can operate at unprecedented high ban……

Copyright @ all rights Shenzhen boyida Circuit Technology Co., Ltd. reserved.