Handset motherboard

    Number: 4874
    product type:Handset motherboard
    Number of layers / plate thickness: 6L / 1.0mm
    Line width / line spacing: 0.76/0.76mm
    Minimum aperture: 0.10mm
    Surface treatment: Shen Jin

    Technical features:2nd order blind buried hole HDI
    Application areas:
    Communication

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